CURE Trainee
Faculty Mentor: Dr. Raj Pulugurtha
Research Summary: Understanding the importance of encasing gap-fill epoxy while designing the circuit structure using a laser, as well as analyzing power consumption, heat transfer, and the structural integrity of vertical packaging compared to horizontal packaging.
Research Summary: Understanding the importance of encasing gap-fill epoxy while designing the circuit structure using a laser, as well as analyzing power consumption, heat transfer, and the structural integrity of vertical packaging compared to horizontal packaging.