Raj Pulugurtha, Ph.D.

Research Advancements: Electronic and Bioelectronic Packaging, Flex and 3D packaging with Heterogeneous System Integration for Emerging Biomedical, Communication and Computing systems, Wearable and Implantable Medical Devices, Advanced Passive Components, Vertical Power Delivery, 5G and 6G Systems Packaging, Antenna Sensor Integration, Power and Data Telemetry, Hermetic Packaging, Interconnects and Connectors
Research Area: Therapeutic and Reparative Neurotechnology
Lab: Bioelectronic and Electronic Packaging Lab